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d a t a s h e e t : c l d - d s 0 5 . 0 0 6 cree ? xlamp ? xr-e led data sheet cree xlamp leds combine the brightness of power led chips with a rugged package capable of operating up to four watts. cree xlamp leds lead the solid- state lighting industry in brightness while providing a refow-solderable design that is optimized for ease of use and thermal management. lighting applications featuring xlamp leds maximize light output and increase design fexibility, while minimizing environmental impact. cree xlamp leds bring lighting-class brightness and effciency to a wide range of lighting and backlighting applications, including portable lighting and fashlights, outdoor and industrial, signaling, architectural, landscaping and entertainment/ advertising installations. table of contents flux characteristics (t j = 2 5 c) ............................................................................... 2 characteristics ......................................................................................................... 3 relative spectral power ........................................................................................... 4 photometric output vs. junction temperature (i f = 350 ma) .................................. 5 electrical characteristics (t j = 25?c) ....................................................................... 6 thermal design ........................................................................................................ 6 relative intensity vs. current (t j = 25?c) ................................................................ 7 typical spatial radiation pattern .............................................................................. 7 refow soldering characteristics .............................................................................. 8 notes ........................................................................................................................ 9 mechanical dimensions (t a = 25c) ....................................................................... 0 tape and reel ......................................................................................................... dry packaging and packaging ................................................................................ 2 features guaranteed minimum fux order codes up to 100 lm in white and 23.5 lm in blue over 80 lm/w available in white available in white (2,600 k to 10,000 k cct), blue and royal blue drive currents: 350 to 1000 ma industrys lowest thermal resistance: 8c/w max junction temperature: 150c ? ? ? ? ? ? industry-leading jedec standard pre- qualifcation testing refow solderable C jedec j-std-020c compatible electrically neutral thermal path rohs-compliant lumen maintenance of greater than 70% after 50,000 hours ? ? ? ? ? subject to change without notice. www.cree.com/xlamp
copyright ? 2006-2007 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. 2 cld-ds05.006 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp flux characteristics (t j = 25c) the following tables describe the available colors and fux for xr-e leds by listing the correlated color temperature or dominant wavelength range for the entire family and by providing several base order codes. it is important to note that the base order codes listed here are a subset of the total available order codes for the product family. for more order codes, as well as a complete description of the order-code nomenclature, please consult the xr-e & xr-c binning and labeling document. color cct range base order codes min luminous flux (lm) order code min. max. group flux (lm) cool white 5,000 k 10,000 k n4 62.0 xrewht-l1-0000-00601 p2 67.2 xrewht-l1-0000-00701 p3 73.9 xrewht-l1-0000-00801 p4 80.6 XREWHT-L1-0000-00901 q2 87.4 xrewht-l1-0000-00a01 q3 93.9 xrewht-l1-0000-00b01 q4 100 xrewht-l1-0000-00c01 neutral white 3,700 k 5,000 k n4 62.0 xrewht-l1-0000-006e4 p2 67.2 xrewht-l1-0000-007e4 p3 73.9 xrewht-l1-0000-008e4 warm white 2,600 k 3,700 k n3 56.8 xrewht-l1-0000-005e7 n4 62.0 xrewht-l1-0000-006e7 color dominant wavelength range base order codes min luminous flux (lm) order code min. max. group dwl (nm) group dwl (nm) group flux (lm) blue b3 465 b6 485 h0 18.1 xreblu-l1-0000-00h01 j0 23.5 xreblu-l1-0000-00j01 color dominant wavelength range base order codes min radiant flux (mw) order code min. max. group dwl (nm) group dwl (nm) group flux (mw) royal blue d3 450 d5 465 12 250 xreroy-l1-0000-00701 13 300 xreroy-l1-0000-00801 notes: cree maintains a tolerance of +/- 7% on fux and power measurements. typical cri for cool white & neutral white (3,700 k C 10,000 k cct) is 75. typical cri for warm white (2,600 k C 3,700 k cct) is 80. ? ? ?
copyright ? 2006-2007 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. 3 cld-ds05.006 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp characteristics characteristics unit minimum typical maximum thermal resistance, junction to solder point c/w 8 viewing angle (fwhm) degrees 90 temperature coeffcient of voltage (white, blue, royal blue) mv/c -4.0 esd classifcation (hbm per mil-std-883d) class 2 dc forward current (white 5000 k) ma 1000 dc forward current (white < 5000 k, blue, royal blue) ma 700 dc pulse current (@ 1 khz, 10% duty cycle) a 1.8 reverse voltage v 5 forward voltage (@ 350 ma) v 3.3 3.9 forward voltage (@ 700 ma) v 3.5 forward voltage (@ 1000 ma) (white 5000 k) v 3.7 led junction temperature * c 150 * note: for lumen maintenance data, see the cree xlamp led reliability document.
copyright ? 2006-2007 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. 4 cld-ds05.006 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp relative spectral power white 0 20 40 60 80 100 400 450 500 550 600 650 700 750 wavelength (nm) relative intensity (%) 5000k - 10000k cct 3500k - 5000k cct 2600k - 2500k cct 5000 k - 10000 k cct 3500 k - 5000 k cct 2600 k - 3500 k cct blue 0 20 40 60 80 100 400 450 500 550 wavelength (nm) relative intensity (%) royal blue blue
copyright ? 2006-2007 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. 5 cld-ds05.006 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp photometric output vs. junction temperature (i f = 350 ma) 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 25 50 75 100 125 150 junction temperature (c) relative photmetric output white blue 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 25 50 75 100 125 150 junction temperature (c) relative radiometric output royal blue
copyright ? 2006-2007 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. 6 cld-ds05.006 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp electrical characteristics (t j = 25?c) thermal design the maximum forward current is determined by the thermal resistance between the led junction and ambient. given an existing thermal resistance of 8c/w between the junction and the solder point, it is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 0 100 200 300 400 500 600 700 800 900 1000 0.0 1.0 2.0 3.0 4.0 5.0 forward voltage (v) forward current (ma) cool white neutral white, warm white, blue and royal blue rth,j-a 10 rth,j-a 12 max current ma 1000 ta max derated ta max derated tj max c 150 c ma ma c ma ma max vf v 4.3 0 3488.4 1000.0 0 2907.0 1000.0 max amb c 150 107 1000.0 1000.0 98.4 1000.0 1000.0 150 0.0 0.0 150 0.0 0.0 0 200 400 600 800 1000 1200 0 25 50 75 100 125 150 ambient temperature (c) maximum current (ma) rj-a = 10c/w rj-a = 12c/w rj-a = 15c/w r j -a = 20c/w 0 100 200 300 400 500 600 700 800 0 25 50 75 100 125 150 ambient temperature (c) maximum current (ma) rj-a = 10c/w rj-a = 12c/w rj-a = 15c/w rj - a = 20 c/w rth,j-a 10 rth,j-a 12 max current ma 1000 ta max derated ta max derated tj max c 150 c ma ma c ma ma max vf v 4.3 0 3488.4 1000.0 0 2907.0 1000.0 max amb c 150 107 1000.0 1000.0 98.4 1000.0 1000.0 150 0.0 0.0 150 0.0 0.0 0 200 400 600 800 1000 1200 0 25 50 75 100 125 150 ambient temperature (c) maximum current (ma) rj-a = 10c/w rj-a = 12c/w rj-a = 15c/w r j -a = 20c/w 0 100 200 300 400 500 600 700 800 0 25 50 75 100 125 150 ambient temperature (c) maximum current (ma) rj-a = 10c/w rj-a = 12c/w rj-a = 15c/w rj - a = 20 c/w
copyright ? 2006-2007 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. 7 cld-ds05.006 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp relative intensity vs. current (t j = 25?c) 0 50 100 150 200 250 0 100 200 300 400 500 600 700 800 900 1000 forward current (ma) relative intensity (%) typical spatial radiation pattern 0 20 40 60 80 100 120 -100 -80 -60 -40 -20 0 20 40 60 80 100 angle () relative intensity (%)
copyright ? 2006-2007 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. 8 cld-ds05.006 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp refow soldering characteristics the following refow soldering profles are provided for reference. cree recommends that users follow the recommended soldering profle provided by the manufacturer of the solder paste used. cree xlamp leds are compatible with jedec j-std-020c. profle feature lead-based solder lead-free solder average ramp-up rate (ts max to tp) 3c/second max. 3c/second max. preheat: temperature min (ts min ) 100c 150c preheat: temperature max (ts max ) 150c 200c preheat: time (ts min to ts max ) 60-120 seconds 60-180 seconds time maintained above: temperature (t l ) 183c 217c time maintained above: time (t l ) 60-150 seconds 60-150 seconds peak/classifcation temperature (tp) 215c 260c time within 5c of actual peak temperature (tp) 10-30 seconds 20-40 seconds ramp-down rate 6c/second max. 6c/second max time 25c to peak temperature 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package, measured on the package body surface.
copyright ? 2006-2007 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. 9 cld-ds05.006 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp notes lumen maintenance projections based on internal long-term reliability testing and standardized forecasting methods, cree projects xlamp leds to maintain an average of 70% lumen maintenance after 50,000 hours, provided the led junction temperature is main - tained at or below 80c. please read the xlamp reliability application note for more details on crees lumen maintenance testing and forecasting. please read the xlamp thermal management application note for details on how thermal design, ambient temperature, and drive current affect the led junction temperature. moisture sensitivity xlamp leds are shipped in sealed, moisture-barrier bags (mbb) designed for long shelf life. if xlamp leds are exposed to moist environments after opening the mbb packaging but before soldering, damage to the led may occur during the soldering operation. the following derating table defnes the maximum exposure time (in days) for an xlamp led in the listed humidity and temperature conditions. leds with exposure time longer than the time specifed below must be baked according to the baking conditions listed below. temperature maximum percent relative humidity 30% 40% 50% 60% 70% 80% 90% 30oc 9 5 4 3 1 1 1 25oc 12 7 5 4 2 1 1 20oc 17 9 7 6 2 2 1 baking conditions it is not necessary to bake all xlamp leds. only the leds that meet all of the following criteria must be baked: leds that have been removed from the original mbb packaging leds that have been exposed to a humid environment longer than listed in the moisture sensitivity section above leds that have not been soldered leds should be baked at 80oc for 24 hours. leds may be baked on the original reels. remove leds from mbb packaging before baking. do not bake parts at temperatures higher than 80oc. this baking operation resets the exposure time as defned in the moisture sensitivity section above. storage conditions xlamp leds that have been removed from original mbb packaging but not soldered yet should be stored in a room or cabinet that will maintain an atmosphere of 25 5oc and no greater than 10% rh (relative humidity). for leds stored in these conditions, storage time does not add to exposure time as defned in the moisture sensitivity section above. rohs compliance the levels of environmentally sensitive, persistent biologically toxic (pbt), persistent organic pollutants (pop), or oth - erwise restricted materials in this product are below the maximum concentration values (also referred to as the thresh - old limits) permitted for such substances, or are used in an exempted application, in accordance with eu directive 2002/95/ec on the restriction of the use of certain hazardous substances in electrical and electronic equipment (rohs), as amended through april 21, 2006. vision advisory claim users should be cautioned not to stare at the light of this led product. the bright light can damage the ey e. 1. 2. 3.
copyright ? 2006-2007 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. 0 cld-ds05.006 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp mechanical dimensions (t a = 25c) all measurements are .1mm unless otherwise indicated. lens re flector substr ate lens re flector substr ate 8.4 mm 5.6 mm 0.7 mm 9.0 mm 7.0 mm 6.46 mm 6.8 mm 4.4 .2 mm 7.0 mm 5.6 mm 1.2 mm 9.4 mm 7.4 mm side vie w to p view bottom view re commended pc board solder p ad 7.0 mm 5.6 mm 0.70 mm 8.4 mm 6.46 mm re commended pc board solder p ad
copyright ? 2006-2007 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. cld-ds05.006 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp tape and reel all dimensions in mm. 330.2 mm
copyright ? 2006-2007 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. 2 cld-ds05.006 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp dry packaging and packaging cree bin code and barcode label pa tent label ta ped edge bin label va cuum-sealed bag desiccant (inside v acuum bag) humidity indicator (inside v acuum bag) cree label with customer p/n / qty / lot# cautionary labels

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